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CYBERPOXY™ 5031
环氧树脂接着剂 / 密封胶
EPOXY ADHESIVE AND SEALANT

	电路板及芯片披覆封装,防拆,接点及Pin脚补强, 电子零件封灌耐电压 21KV/mm Cyberpoxy 5031 is a 2-component flexible epoxy which provides excellent adhesion to metals such as aluminum, copper, steel, brass, and galvanized steel. It exhibits high peel strength and good adhesion for a variety of bonding applications in the sporting goods, appliance, metalworking, and furniture markets. Cyberpoxy 5031 can also be used as a potting compound for PCB’s and flip chips.
	Cyberbond Cyberpoxy 5031为黑色双液型环氧树脂接着剂, 电路板专用(Chip on board), 高覆着性,耐电压 21KV/mm, 电路板及芯片披覆封装,防拆,接点及Pin脚补强, 电子零件封灌. Cyberpoxy 5031 对电路板及芯片之附着性高. 可使用于接着,灌注, 补缝. 密封及零件之保护封灌, 电气及电子零件等产品组装。 Cyberpoxy 5031可使用于接着不同材质, 可用于接着大部分金属电镀材料、不锈钢、玻璃、陶瓷及其它复合材料。

	APPLICATIONS OF CYBERLITE PRODUCTS :
	结构型接着 Structural Bonding 电器绝缘 Electric Insulation 零件组装 Component Assembly 密封 Sealing 灌注及填缝 Potting 接着组装 Assembly 线材固定 Wire tack 零件固定 Fixture 批覆保护 Protection 结构补强 Reinforce 电子接点补强 Pin Reinforce 披覆封装 Encapsulation		产品技术数据 Data Sheet
			物质安全数据表 MSDS
			Cyberpoxy 产品特性表 Products
			Dual Cartridge mixer 混合管
			在线点胶及自动化 On lin Dispense
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	使用方法 : Instructions For Use
	Dual Cartridge Application 使用方式: 若使用专用Dual-cartridge胶枪(50ml 包装), 接着剂挤出时会经过前端之静态混合管(static mixer)依比例混合, 混合后之接着剂直接施胶于欲组装之其中之一工件上, 再可工作时间(working time)内将两工件组合, 较小之工件可使接着剂溢胶以增加接着面积获得更高之接着强度, 间系较大之工件有时需两面上接着剂, 并轻压使接着剂分散以确保接着剂与两材质接触到.
	Typical Process Methods Apply mixed adhesive directly to one surface in even or beaded manner. Assemble the parts within the recommended working time. Obtain firm contact between the parts to minimize any gap and ensure good contact. A small fillet of adhesive should flow out of the edges to show adequate gap-filling. For large gaps, apply enough adhesive to both surfaces and spread to cover the entire area, or make a bead pattern on both sides which will allow flow throughout the bond line.	Instructions for dual cartridge package applicator - 50ml package (Chinese)