CYBERPOXY™5030
环氧树脂接着剂 / 密封胶 EPOXY ADHESIVE AND SEALANT
透明
30分钟初步固化
机械、电子零组件及玻璃之组装
接着, 密封及灌注
Cyberpoxy 5030 is a medium curing epoxy adhesive, which will have
handling strength in 30 to 45 minutes and will also cure rapidly in
thin films or at low temperatures. It is an excellent industrial adhesive
characterized by a non-critical equal ratio mixing range. Cyberpoxy
5030 will readily bond most plastics, metals, ceramics, paper, wood,
and some rubbers. It is ideally suited to potting and encapsulating
applications for electronic components and assemblies. Cyberpoxy 5030
is well suited for bonding applications in jewelry manufacturing,
product assembly, and many aircraft uses. When cured Cyberpoxy 5030
also seals against dust, dirt, and contamination from foreign particles
due to its superior gap filling capabilities.
Typical
Process Methods
Apply mixed adhesive directly to one surface in even or beaded manner.
Assemble the parts within the recommended working time. Obtain firm
contact between the parts to minimize any gap and ensure good contact.
A small fillet of adhesive should flow out of the edges to show adequate
gap-filling. For large gaps, apply enough adhesive to both surfaces
and spread to cover the entire area, or make a bead pattern on both
sides which will allow flow throughout the bond line.