CYBERPOXY™ 5030
环氧树脂接着剂 / 密封胶

EPOXY ADHESIVE AND SEALANT

  透明 30分钟初步固化
机械、电子零组件及玻璃之组装
接着, 密封及灌注


Cyberpoxy 5030 is a medium curing epoxy adhesive, which will have handling strength in 30 to 45 minutes and will also cure rapidly in thin films or at low temperatures. It is an excellent industrial adhesive characterized by a non-critical equal ratio mixing range. Cyberpoxy 5030 will readily bond most plastics, metals, ceramics, paper, wood, and some rubbers. It is ideally suited to potting and encapsulating applications for electronic components and assemblies. Cyberpoxy 5030 is well suited for bonding applications in jewelry manufacturing, product assembly, and many aircraft uses. When cured Cyberpoxy 5030 also seals against dust, dirt, and contamination from foreign particles due to its superior gap filling capabilities.
 
 

Cyberbond Cyberpoxy 5030为快速固化双液型环氧树脂接着剂, 具有高抗拉强度及透明性。 初步固化时间约为30-45分钟, 可使用于接着不同材质, 可用于接着大部分金属电镀材料、不锈钢、玻璃、陶瓷及其它复合材料。
Cyberpoxy 5030 可应用于机械、电子零组件及玻璃之组装接着, 密封及灌注。 

 

  APPLICATIONS OF CYBERLITE PRODUCTS :    
  结构型接着 Structural Bonding
电器绝缘 Electric Insulation
零件组装 Component Assembly
密封 Sealing
灌注及填缝 Potting
接着组装 Assembly
线材固定 Wire tack
零件固定 Fixture
批覆保护 Protection
结构补强 Reinforce
电子接点补强 Pin Reinforce
披覆封装 Encapsulation
产品技术数据 Data Sheet
物质安全数据表 MSDS
Cyberpoxy 产品特性表 Products
Dual Cartridge mixer 混合管
在线点胶及自动化 On lin Dispense
型录下载 Catalogues Download
最新讯息 New Products
   


使用方法 : Instructions For Use

 

Dual Cartridge Application 使用方式:

若使用专用Dual-cartridge胶枪(50ml 包装), 接着剂挤出时会经过前端之静态混合管(static mixer)依比例混合, 混合后之接着剂直接施胶于欲组装之其中之一工件上, 再可工作时间(working time)内将两工件组合, 较小之工件可使接着剂溢胶以增加接着面积获得更高之接着强度, 间系较大之工件有时需两面上接着剂, 并轻压使接着剂分散以确保接着剂与两材质接触到.
  Typical Process Methods
Apply mixed adhesive directly to one surface in even or beaded manner. Assemble the parts within the recommended working time. Obtain firm contact between the parts to minimize any gap and ensure good contact. A small fillet of adhesive should flow out of the edges to show adequate gap-filling. For large gaps, apply enough adhesive to both surfaces and spread to cover the entire area, or make a bead pattern on both sides which will allow flow throughout the bond line.

 

 

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